Thermal pad Snowman with thermal conductivity of 13.8 W/m·K and thickness of 1.0 mm is designed for efficient heat transfer between electronic components and cooling systems. It provides reliable cooling for processors, graphics cards, chipsets, SSDs, and other elements.

Main specifications:

• Thermal conductivity: 13.8 W/m·K — high thermal conductivity for effective heat dissipation.

• Size: 120×120 mm — universal size suitable for most devices.

• Thickness: 1.0 mm — provides better contact on uneven surfaces and compensates for gaps.

• Color: Gray — standard color for thermal pads.

• Density: approximately 3.5 g/cm³ — stable structure and durability.

• Hardness: 30–50 Shore C — moderate hardness allowing good filling of micro irregularities.

Usage instructions:

• Clean the surfaces of components and radiator from dust and contaminants.

• Carefully place the thermal pad between the cooled element and the radiator, ensuring it fully covers the contact surface.

• Assemble the cooling system, ensuring reliable and even pressure of the radiator.

• Check the system operation, making sure component temperatures are stable.

Advantages:

• High thermal conductivity ensures effective cooling.

• Thickness of 1.0 mm better compensates for unevenness and ensures stable contact.

• Universal size fits various devices.

• High electrical insulation reduces the risk of short circuits.

• The material is safe and does not cause corrosion.

Breakdown voltage: 10 kV/mm — high insulation capability prevents short circuits.
Corrosion activity: Does not cause corrosion, safe to use.