🇬🇧 English Translation

Thermal Paste MIICAM MX-30 (30 g)

General Description:
The MIICAM MX-30 thermal paste is designed to improve heat transfer between heated electronic components (such as processors, video chips, and transistors) and cooling systems — heat sinks, coolers, or heat pipes. It provides efficient heat dissipation, prevents overheating, and increases the stability and reliability of electronic equipment.

Technical Specifications:

• Model: MIICAM MX-30

• Product Type: Thermal conductive paste (thermal grease)

• Thermal Conductivity: 13.5 W/m·K (value may vary depending on batch)

• Volume / Weight: 30 g

• Color: Gray

• Density: ~2.6 g/cm³

• Operating Temperature Range: –50 °C to +250 °C

• Electrical Conductivity: None (electrically non-conductive)

• Viscosity: Medium, easy to apply evenly

• Base: Silicone oil with micro-particles of high thermal conductivity metal oxides

Advantages:

• High thermal conductivity ensures efficient heat dissipation

• Electrically non-conductive — prevents short circuits

• Easy to apply and spreads evenly on the surface

• Long-term durability and stability of characteristics

• Compatible with most cooling systems and materials (aluminum, copper, nickel)

Applications:

• Central processing units (CPU)

• Video chips and graphics processors (GPU)

• Chipsets, memory modules, power transistors

• Radio-electronic and industrial equipment