🔹 Thermal Pad 120×150 mm

General Description:
The thermal pad sized 120×150 mm is designed for efficient heat dissipation in various electronic devices. It is used to fill gaps between components and heatsinks, ensuring reliable contact and improving heat transfer.

Technical Specifications:

• Size: 120×150 mm

• Thickness: 1.5 mm (typical thickness for universal pads)

• Thermal Conductivity: 6 W/m·K (provides efficient heat dissipation)

• Operating Temperature Range: from -40 °C to +200 °C

• Color: gray

• Material: silicone base with fillers that provide high thermal conductivity

• Application: suitable for use in computers, video cards, processors, chipsets, power supplies, and other electronic devices

Features:

• Versatility: suitable for various types of devices and components

• Flexibility: easily adapts to uneven surfaces

• Ease of Use: easily cut to the required size

• Safety: electrically non-conductive, preventing short circuits

Applications:

• Cooling PC components: video cards, processors, chipsets

• Electronic devices: laptops, gaming consoles, power supplies

• Repair and maintenance: replacement of old or damaged thermal pads

Usage Recommendations:

• Surface Preparation: clean contact surfaces from dust and contaminants

• Cutting: cut the pad to the required size if necessary

• Installation: carefully place the thermal pad between the component and the heatsink

• Pressure: ensure even pressure for effective heat dissipation