Thermal Pad SNOWMAN 16.8 W/m·K (1.5 mm, 120×120 mm)

General Description:
The thermal pad is designed for efficient heat dissipation from microchips, transistors, controllers, power modules, and other electronic components to heat sinks, housings, or other heat-dissipating surfaces. It ensures reliable thermal contact even on uneven surfaces and under vibration, increasing the stability and service life of electronic devices.

Technical Specifications:

• Model: SNOWMAN Thermal Pad

• Thermal Conductivity: 16.8 W/m·K

• Thickness: 1.5 mm

• Size: 120 × 120 mm

• Material: Silicone elastomer base with high thermal conductivity filler

• Color: Blue (or gray, depending on batch)

• Operating Temperature Range: –40 °C to +200 °C

• Hardness (Shore A): ~30–40

• Electrical Insulation: Yes (non-conductive material)

• Adhesion: Self-adhesive, does not require additional glue

Applications:

• Graphics cards, processors, power modules

• Power supplies, controllers, LED drivers

• Electronic devices with high heat generation

Advantages:

• High thermal conductivity — 16.8 W/m·K ensures efficient heat dissipation

• Easy installation and replacement

• Flexible and elastic for tight surface contact

• Excellent electrical insulation

• Long-term durability and stability of properties during operation